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POWER

Low-Power Design

Power is three separate problems wearing one name: dynamic switching, clock distribution and static leakage. They respond to different techniques, they dominate at different nodes, and a design that optimises the wrong one arrives at signoff having spent effort without moving the number that mattered.

UPFClock gatingPower gatingRetentionDVFSLeakage
Which power component dominates, and when
TYPICAL CONTRIBUTIONClock distributionalmost always top twoDynamic switchingactivity-drivenStatic leakagefirst-order below 28 nmMemoryarray leakage and accessI/Ohigh pin-count partsClock power is distributed, so it never appears as a line item next to any block.
WHERE POWER GOES

Three problems, three answers.

Power components and techniques
ComponentDriverTechniqueDominant when
Dynamic switchingCapacitance, voltage squared, switching activityActivity reduction, operand isolation, lower supplyHigh-activity datapaths at any node
Clock distributionClock tree capacitance and toggle rateClock gating at every level of hierarchyAlmost always a top-two contributor
Static leakageThreshold voltage, temperature, areaMulti-threshold cells, power gating, body biasBelow 28 nm, and at high temperature
MemoryArray leakage and access energyBank partitioning, retention modes, access reductionMemory-heavy designs
I/ODrive strength and off-chip capacitanceInterface selection, termination disciplineHigh-pin-count parts

Clock power is the one most often underestimated, because it is distributed and therefore does not appear as a line item next to any block.

POWER INTENT

Why UPF exists.

Why it is a file rather than a convention

Power intent described in comments and reviews gets implemented differently by synthesis, place-and-route and verification. Described in UPF, it is a single source that every tool reads — which is the only way a multi-domain design closes without a class of bug that only appears at a domain boundary.

THE NODE EFFECT

Why the answer changes with geometry.

At mature nodes leakage is small and dynamic power dominates, so effort goes into activity reduction and clock gating. Power gating buys little and costs area and complexity.

Below 28 nm leakage becomes a first-order contributor, particularly at temperature, and a part that idles for most of its duty cycle can burn most of its energy doing nothing. Power gating and multi-threshold libraries stop being refinements and become the primary technique.

This is one of several reasons node selection is an architecture decision rather than a procurement one. A long-lifecycle industrial part that spends its life idling may well use less energy at 90 nm than at 16 nm, which is the opposite of the intuition.

WHERE THIS APPLIES

Industries this serves.

COMMON QUESTIONS

What engineers ask about this.

01

What is UPF?

The Unified Power Format, a file describing power intent — domains, isolation, retention, level shifting, legal power states and sequencing — that synthesis, place-and-route and verification all read, so a multi-domain design is implemented consistently.

02

Which contributes more, dynamic power or leakage?

It depends on the node and the duty cycle. At mature nodes dynamic dominates. Below 28 nm leakage becomes first-order, especially at temperature, and a part that idles most of the time can spend most of its energy doing nothing.

03

Why is clock power often underestimated?

Because the clock tree is distributed rather than being a block, so it does not appear as a line item next to anything. It is frequently one of the two largest dynamic contributors, which makes hierarchical clock gating one of the highest-return techniques available.

KEEP READING

Related work.

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