Silicon · Connectivity · Intelligence
Semiconductor, wireless, embedded and connected hardware — architecture through volume, one team.
What this is
Semiconductor design, licensable IP, 5G and O-RAN radio, edge AI, industrial vision and connected hardware — brought together by the people who will also tell you when not to build it.
What we actually sell
Any competent firm can execute a specification. The expensive part of a programme is deciding which specification is worth executing — and that decision gets made early, quietly, and usually by whoever is least incentivised to question it.
So we argue first. An inspection problem that is really a lighting problem. A conversion for a design whose requirements are still moving. Saying so before a purchase order costs us a piece of work. Saying it afterwards costs us a customer.
What we can show you
Not a customer logo wall. The figures Faststream has published or can demonstrate, with the caveat attached where a caveat belongs.
Platforms
Organised around what customers build rather than around how we are staffed. Most programmes draw on two or three.
Where the work goes
Not a service list. The reason each of these defeats competent teams, and the thing that has to be true before any of it works.
Most failed inspection pilots are lighting failures wearing an algorithm costume.
WirelessWhich makes the digital front end an operating-cost decision, not a refinement.
Connected productsPartition layout, signing and rollback are fixed before the first unit leaves the factory.
Secure siliconPut that anchor in silicon and replacing it means replacing the part.
Products
A product is an artefact with a datasheet, a version and a commercial model. Design work lives under System Integration. Every item carries its maturity status.
What we actually do
Programmes stall at the boundaries between these, not inside them. Select a layer to see what it involves.
Power, latency, cost and thermal envelope allocated across the whole system before anything is designed. Most programmes that fail late failed here, quietly, in week three.
RTL through to a signed-off tapeout package, or a licensable core dropped into someone else’s SoC. Node chosen against the application rather than by generation.
Schematic, stack-up, controlled-impedance layout and the power integrity work that decides whether a fabricated board behaves like the simulation.
The verified chain from an immutable first stage upward, the drivers beneath it, and an update path designed before the first unit ships rather than after.
Getting the data off the device and proving it in the environment it will actually run in — including the regulatory approval that sits on the critical path.
The imaging chain, the sensing design and the model — in that order, because most failed inspection programmes are lighting failures wearing an algorithm costume.
The unglamorous half that decides support cost: identity at manufacture, a registry that means something, staged update, and diagnostics that avoid a site visit.
Inside the unit
Select a part. Most of the cost, the heat and the difficulty sit in three of these, and they are not the three most specifications spend their pages on.
Element count and spacing set by band and coverage. On massive MIMO configurations this is the largest single contributor to both cost and calibration effort.
Dominates dissipation and site energy. Efficiency here is a recurring operating cost across the whole network life, not a capital line item.
Crest factor reduction and digital pre-distortion. Reduces peak-to-average ratio, then corrects the amplifier's own distortion so it can be driven harder for the same spectral compliance.
FFT, cyclic prefix, resource mapping and beamforming weights. Everything here runs to a deadline set by the subcarrier spacing rather than by the design.
eCPRI over optical to the distributed unit, carrying frequency-domain data at the 7.2x split. The tightest timing requirement in the network passes through here.
GNSS discipline with IEEE 1588 and SyncE. In time-division duplex every site must agree on where the transmit and receive boundaries fall, or the symptom appears in a neighbour's network.
Sized for amplifier peak rather than average draw, with the sequencing and protection an outdoor unit needs across its supply range.
Treated as part of the RF and thermal design rather than as packaging. Heatsinking is what limits achievable output power once the amplifier is chosen.
What we will not do
There is no customer logo wall here, because we have not been given permission to publish one. No advisory board of named experts, because we would have had to invent it. No certification badges, because a stale claim is worse than none.
A supplier who will not overclaim to win your business is a supplier who will not overclaim about your programme once they have it. That is the whole argument.
Tell us the specification, the constraint and the deadline. Programmes that cross silicon, radio, embedded and AI are where Faststream is strongest.
Faststream Technologies is a United States semiconductor and connected-product engineering company founded in 2008. It licenses semiconductor IP cores, supplies 5G and O-RAN radio subsystems, industrial AI vision systems, IoT gateways and asset-tracking hardware, and integrates them into production products across silicon, embedded systems, connectivity and cloud.
No. Faststream Technologies is a semiconductor and connected-product engineering company. It is unrelated to Faststream Recruitment, the maritime and shipping recruitment firm, and unrelated to the UK Civil Service Fast Stream programme.
Faststream Technologies is a United States company with an engineering centre in Bengaluru, India. Programmes are delivered from both locations depending on the work and any export-control or data-residency requirements.
Both. The semiconductor IP catalogue is licensable and supplied with verification collateral and integration support. Design and integration work is engaged separately under System Integration, and the three business models are set out on the How we engage page.