Analog-to-digital conversion IP for integration into mixed-signal SoCs, where the converter has to coexist on a die with switching digital logic. The specification that matters is rarely the standalone one — it is what the converter achieves after integration.
A converter that meets its specification on a test bench may not meet it on a die beside a switching regulator and a digital block clocking at full rate. Supply noise, substrate coupling and thermal gradients all shift analog performance, and none of them appear in a standalone schematic simulation.
Which is why converter IP is as much an integration discipline as a circuit one. Floorplanning, supply partitioning, isolation strategy and post-layout verification across corners determine whether the specification survives the journey onto a real die.
Resolution, sample rate and architecture are selected against the application rather than offered as a fixed part, because a sensor front end and a communications receiver want very different converters.
| Parameter | Detail |
|---|---|
| Function | Analog-to-digital conversion for mixed-signal SoC integration |
| Configuration | Resolution, sample rate and architecture selected against the application |
| Integration | Supplied with floorplanning, isolation and supply partitioning guidance |
| Verification | Post-layout simulation across process, voltage and temperature corners |
| Node | Selected by application; analog content frequently favours mature nodes |
| Typical markets | Mixed-signal SoC, instrumentation, industrial, sensor front ends |
Maturity — silicon-proven, FPGA-validated or RTL stage — is confirmed at enquiry for the specific configuration you need, rather than claimed generically here.
Send the target node, the interface requirements and the integration context. If this is not the right fit, that will be said early rather than discovered at integration.
Because supply noise from neighbouring switching blocks, substrate coupling from digital activity, thermal gradients across the die and layout parasitics all shift analog performance in ways a standalone schematic simulation does not capture.
Frequently a mature one. Supply headroom, device matching and embedded non-volatile memory availability all favour mature nodes for analog-heavy parts; advanced nodes win on digital density, which is a different constraint.
Tell us the specification, the constraint and the deadline. Programmes that cross silicon, radio, embedded and AI are where Faststream is strongest.