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System on Chip testing is befalling more complex as processes become more refined, circuit scale increases, circuit operation becomes faster, and much less power is consumed. Our company’s Design for Test (DFT) reduces the difficulty and cost associated with testing an integrated circuit. Incorporated with ever-growing design complexity with multiple memories, mixed-signal blocks, and IPs from various vendors overloaded into a single SoC, Design for Test (DFT) implementation and Production Test signoff has become a big challenge.

To overcome this issue, in addition to compressed scan, memory BIST, and boundary scan DFT (Design for Testability), we perform high-quality testing using various types of DFT technology for improved test quality and yield. Faststream Technologies persuades Design for Test services to assist you to get rid of these problems by setting up a Design for Test strategy that delivers improved Design for Test (DFT) execution quality and reduced time-to-market.

DFT Technologies Used by Faststream


  • Carrying out Scan ( Compression/ non-compression )execution with industry-standard tools
  •  Test using on-chip PLL clocks
  • ATPG (stuck-at, at-speed, SDD, Path delay, new faults based on the technology and strategy) vector generation, Coverage analysis, Pattern (Verilog, WGL) simulation (Gate Level Simulations (unit-delay, extracted dealy with SDF).
  • Memory redundancy repair process and fault diagnosis technologies for improved yield
  • Performing Memory BIST, Simulation & Vector preparation for good simulation and repair flow with fault Injections with industry-standard EDA tools
  • Experienced professionals can support in-house tool based implementation/verification for our customers
  • Test that controls power consumption during testing
  • Logic BIST
  • IEEE 1149.1, IEEE1149.6 compliance test controllers (JTAG)
  • Certifying the design rectitude on pre and post DFT (Design for Testability) by Formal Verification
  • ATE support on pattern stabilization, split lot analysis / Diagnosis of Structural (scan, MBIST) failures



  • End-to-end support – From design to silicon.
  • Off-the-shelf components – Reduce DFT turnaround times.
  • Training support – Bridge the gap in experience levels; Remote support from Faststream’s office to resources at customer sites.

Design for Testability