Embedded Hardware Development is an integral part of product development. Beginning from the initial architecture phase till the manufacturing support, our product engineering services comprises of board design, PCB layout, programmable logic and enclosure designs integrating FPGAs, DSPs, microprocessors, and complex RF, analog, and power systems.
We offer the complete package of services covering all the stages of the product development lifecycle starting from embedded hardware design, embedded software design, mechanical design, to validation and verification.
The mechanical design of the system depends on the mechanical, electronics and packaging design professionals. To achieve a single design that fulfills all of the overall criteria is a crucial element in the mechanical design portion of the embedded hardware design. By focusing on a single approach, the effort of perfecting the design can be focused on a single design. The risk involved in designing is handled through research and experimentation in the earlier stages.
Similar to mechanical design case, risk reduction at initial phase is a priority. An example of risk reduction could involve a trial hardware layout of the components on the circuit board to ensure they all fit well. The trial layout would ascertain the physical layout, confirm that the heat could be dissipated and all the components could fit using the preferred packaging approach and that other constraints were met.
The main tasks with plastic cases are getting the connectors aligned exactly with the case and ensure that case’s closing mechanism is working well. Issues of shorts between the boards and the case can arise due to the fact that box size needs to be minimum. At the end of the integration process, the gold unit which is achieved along with schematics, gerbers, and CAD drawings are passed to manufacturing.
An automated manufacturing load and test system are created as a part of embedded software and hardware development. During manufacturing two tests are essential. The test is conducted to ascertain that the electronics assembled into the final device are working exactly like the golden unit. The second phase of testing is done after the electronic test and final assembly where the final unit is powered on and tested.
The hardware design can be divided in many ways. Since it affects the physical device, so client marketing is also involved. The work can be split between client resource and our resources.
• i.MX6x, i.MX6UL, i.MX6 POP, Vybrid, MPC864x, i.MX27, i.MX257, i.MX258, i.MX233, i.MX50, i.MX51,i.MX53, PowerPC 860, 8260, 750/755 from Freescale/NXP
• Keystone II, DM355/64xx, DSP TMS320C6455, OMAP 3530, AM437x, DM8168, CC2541, OMAP 850 from TI
• Connectivity: USB, Ethernet, CAN, Bluetooth, WiFi, PCIe
• Serial: UART, SPI, I2C
• Multimedia: Audio, Video, Camera
• Storage: SSD, SATA, Flash, SDRAM, SD/MMC
• UI: LCD, LVDS, HDMI, DVI, Keypad
• GPIO, A/D, D/A, and analog
• ORCAD V 16.x or above
• Cadence Allegro V16.x or above
• Hyperlynx 6.0 or above
• GC Prevue
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