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FLAGSHIP CAPABILITY

From architecture to production deployment.

System integration is Faststream's flagship capability: owning the parts of a product that fall between disciplines, where most programmes actually get stuck. The chip works and the board does not. The board works and the firmware does not. Everything works and it will not pass certification. Integration is where those problems live, and it is deliberately not described as engineering services.

One partner across the whole chain
01Architecturebudgets and partitioning02SiliconASIC, FPGA or IP03HardwarePCB, RF, bring-up04Embeddedboot, drivers, update05Connectivitylink and certification06Intelligencesensing and inference07Deploymentcloud, OTA, manufactureProgrammes stall at the boundaries. Someone has to be accountable for them.
CAPABILITIES

What integration covers.

SILICON

Hardware-Software Co-Design

Workload-driven partitioning, virtual prototyping, early software bring-up and HW/SW co-verification across abstractions.

SILICON

Built-In Self-Test

LBIST and MBIST, PRPG/MISR signatures, memory repair, and power-on and in-field self-test for functional safety.

SILICON

Post-Silicon Validation & Bring-Up

Bring-up, PVT characterization and shmoo, the silicon-debug loop, system-level test and sign-off to volume.

SILICON

Physical Design & Timing Closure

Floorplan, placement, CTS and routing; congestion, MCMM timing, IR drop, EM and thermal — and what to do when a block will not close.

SILICON · AI

Agentic Chip Design

RL optimisation, LLM agents for RTL and verification, and agents that orchestrate the EDA flow — with the engineer owning intent and sign-off.

SILICON

Silicon by Vertical

Chips designed across healthcare, IoT, 5G, wireless, consumer and infrastructure: SoC, RF, sensor AFE, NFC/RFID, BLE and security.

SILICON

ASIC & SoC design

Architecture, RTL, verification, DFT, timing closure, physical implementation and tapeout.

SILICON

FPGA design

Architecture, HDL, timing closure, resource optimisation and hardware bring-up.

SILICON

FPGA-to-ASIC conversion

Dependency removal, technology mapping, equivalence and physical implementation.

WIRELESS & RF

RF on FPGA

DUC/DDC, CFR, DPD, FFT, filters and channelizers in fabric, on RFSoC with direct-RF sampling.

SILICON

FPGA prototyping & emulation

Multi-FPGA ASIC prototyping so software and validation start months before tapeout.

COMPUTE

FPGA acceleration

Offloading AI inference, video, crypto and line-rate data to fabric over PCIe/CXL.

WIRELESS & RF

RF Front End & Transceivers

RF front end plus integrated transceivers from Analog Devices (RadioVerse, MxFE) and Texas Instruments (AFE79xx), closed with CFR/DPD.

ANALOG

Mixed-signal & RF

Data converters, PLLs, references, power management and RF front ends.

HARDWARE

Hardware & high-speed PCB

Schematic, layout, signal and power integrity, bring-up and validation.

SOFTWARE

Embedded software

Linux, RTOS, BSPs, bootloaders, drivers, firmware and middleware.

CLOUD

Cloud & device management

Ingest, device registry, fleet control, OTA update and analytics.

PRODUCTION

Manufacturing transition

NPI, test coverage, provisioning, yield analysis and lifecycle support.

AI

AI & perception

Vision, sensor fusion, edge inference and the model lifecycle around them.

POSITIONING

Why not “engineering services”.

The phrase describes a staffing arrangement — hours supplied against a customer's plan. That is a real business, and it is not this one.

System integration means owning an outcome across disciplines: taking responsibility for the fact that the ASIC, the board, the radio, the firmware and the cloud have to work as one thing, and that the boundaries between them are where the schedule is lost. A company that only supplies specialists cannot own that, because nobody in the room is accountable for the gap.

LIFECYCLE

The full path.

01

Architecture

System partitioning, interface definition, technology selection, and the power, cost and performance budgets everything downstream is held against.

02

Silicon

ASIC, SoC or FPGA implementation, or IP integration into an existing device.

03

Hardware

Schematic, high-speed layout, signal and power integrity, prototype build, bring-up and validation.

04

Embedded

Bootloader, BSP, drivers, RTOS or Linux, middleware, firmware and update mechanism.

05

Connectivity

Cellular, Wi-Fi, BLE, UWB, NFC, LPWAN or satellite, with antenna integration and certification path.

06

Intelligence

Vision, sensor fusion, edge inference and analytics where the product needs to decide rather than report.

07

Cloud

Ingest, device registry, fleet management, over-the-air update, dashboards and integration with customer systems.

08

Manufacturing

Test strategy and coverage, factory provisioning, yield analysis, qualification and lifecycle support.

COMMON QUESTIONS

What engineers ask before they call.

01

What does system integration mean at Faststream?

Owning an outcome across disciplines rather than supplying specialists into a customer's plan. It covers architecture, silicon, hardware, embedded software, connectivity, intelligence, cloud and manufacturing transition, with accountability for the boundaries between them.

02

Can Faststream join a programme that is already underway?

Yes, and it is common — usually where a specific discipline is the bottleneck, or where an integration problem has surfaced that no single existing team owns.

03

Is ASIC and SoC design a product?

No. It is a capability delivered as an engagement, which is why it sits under System Integration rather than under Products. A product is something you receive; a design service is work that gets done.

KEEP READING

Related work.

BUILD WITH FASTSTREAM

Bring us the difficult part.

Tell us the specification, the constraint and the deadline. Programmes that cross silicon, radio, embedded and AI are where Faststream is strongest.