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ASIC and System-on-Chip design are one of the most challenging avenues in today’s electronic products marketplace. Providing such high-technology services will require a top-of-the-line electronic engineering skill set and forward edge vision. Faststream Technologies embodies these qualities and more when it tackles design challenges using the latest, effective design strategies that benefit our customers’ business and help them reach their goals before their end plan.


We have the ability to deliver products with the best features that optimize costs, size and power consumption & have a distinct competitive advantage. Faststream provides clients the power and methods that enable rapid design done right the first time.

ASIC Prototyping

By using Virtex UltraScale devices, we simplify design partitioning through high logic capacity, ASIC-like clocking, over 90% device utilization, high-speed transceivers for pin multiplexing and enhanced routing. Innovative device capacity considerably reduces the number of partitions, thereby, simplifying board layout.


Analog and Mixed Signal ASIC Design:


Our Mixed-signal ICs process both analog and digital signals together. A mixed-signal integrated circuit is any integrated circuits that have both analog circuits and digital circuits on a single semiconductor die. Our Analog Mixed Signal Design Services include Architecture Planning and Feasibility Analysis, Performance and Functional Modeling, Circuit Design and Simulations, Design and Layout Migrations, Engineering Sample validation etc.

Our analog and mixed-signal ASICs are found in products used by various consumers across many different market segments from healthcare to cosmetics, industrial sensors to flight control instrumentation, mobile devices to credit card scanners and many more.


RF ASIC Design:


RF design flow leverages the Mixed-Signal methodology to decrease risk to RFIC design. Especially, for RFICs with significant digital content. At Faststream Technologies, the system-wide requirements are verified first using traditional link budgets then re-verified using Chip-in-Package on PCB simulations. To improve simulation times, the Co-Simulation between RF blocks, Analog blocks, and Digital logic is enabled using behavioral models. By doing this, we are confident that the RFIC will not only meet the device specification but will work in the system in one pass.


SOC Integration


The quality of the techniques used in the configuration and integration of complex IP blocks will have a significant influence on an SoC’s development schedule and performance. Our Design Engineers are skilled in SoC configuration and integration and possess extensive knowledge of DesignWare Interface IP. Faststream’s system-level designers ensure that design specifications accurately capture design intent at both the block and chip levels, helping to minimize iterations between the architecture and RTL implementation.


RTL Coding and Linting


By using static analysis to enforce coding guidelines, we detect functional issues before simulation and ensure high-quality RTL. Low noise and ease of debugging are the parameters the RTL linting rules design adhere to. Lint issues are quickly resolved by our integrated debugger. It includes custom views for focused debug, debugging violations and status binning & comments per violation for overall data management.


FPGA to ASIC Conversion


Faststream has been involved in migrating FPGA designs to ASICs for over a decade now. They are giving the benefits of cost reduction for existing FPGA production volumes, providing a pin for pin FPGA migration to ASIC, Integration of multiple FPGAs into one ASIC that allows us to free up more space, We also facilitate production support for End of Life FPGAs. Our customers have been able to reduce system costs considerably by successfully substituting their high-cost FPGAs with drop-in ASIC replacements in over 1000 applications.


ASICs for MEMS has been developed by the experts at Faststream Technologies, using their ample experience in interfacing with MEMS devices like sensors, resonators and optical MEMS. The device is a configurable ASIC wherein its front-end parameters can be adjusted to work with different capacitance ranges, different drive frequencies, different loop configuration (OL or CL) and different drive frequencies and also with several types of gyros and accelerometers.

By integrating this ASIC with relevant hardware and software, our team has created an inertial sensor development platform that allows a user to configure the ASIC to a specific inertial sensor. This is done by manipulating the front-end parameters and then performing evaluation & characterization of the inertial sensor. This facilitates the measuring of Quality Factors, Existing Parasitic Modes and Resonance Frequencies.


We collaborate ASIC Design Services with Sensor Interface using the following operation:


  • Design and Manufacture of MEMS and Sensor Demonstration with Prototype Electronics.
  • Optimize MEMS, ASIC Development and Packaging Solutions.
  • Test & Evaluate sensor for final form and Manual Trim for Optimized performance.
  • Statistical Data Collection from Engineering Sample
  • Production mask, test, and trim.
  • Automated trim and Performances Optimization.